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0161 796 6511
MANUFACTURING
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HillmanTechnology have been supplying manufacturing for over a decade as a significant force in the contract electronics manufacturing industry.
A full service of manufacturing solution is provided by Hillman with an integrated collaborative approach to product design, component procurement,
assembly, testing, packaging and distribution. Working with state of the art technology and assembly functions, Hillman delivers accurate and reliable products. We offer a complete service in the UK that complements the High standard manufacturing facility in Shenzhen China. From high specification new product development to volume assembly, Hillman has the expertise and experience to successfully deliver an end to end contract electronics manufacturing solution. Hillman Technology have the facility of manufacturing a full SMT contract assembly service with surface mount PCB including manual, semi-automatic or fully automated assembly.  Hillman Technology offer solutions that fulfil your manufacturing needs with a LOW COST and HIGH QUALITY. From Low volume sample PCBA to Full Production High population multilayer BGA, Quad Flat Packs and Fine Pitch PCB, SMD Components to 0201". UP to 90,000,000 component placements per month. We also offer a FULL or PART procurement or FREE ISSUE parts supplied from customer. Quality Certifications are including ISO9001: 2008; QC080000: 2012 Hazardous Substance Process Management; ISO13485: 2012 Medical-device Quality Management System. Factory has succeeded to launch MES (Aegis) and ERP (QAD) system management software, and also focus on continuous improvement Kaizen management actions. |
CAPABILITIES
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FULLY-AUTOMATED HIGH SPEED LINES (SMT AND THROUGH-HOLE) Our SMT and through-hole lines are fully automatic, with your product carried by conveyor through the entire assembly process. With separate lines for leaded and unleaded components, our lines are fast, efficient and perfect for higher-volume orders. RIGID, SEMI-RIGID, FLEX CIRCUIT AND ALUMINUM SUBSTRATE Our technical staff members are familiar with rigid, semi-rigid, flex circuit and aluminum substrate assembly. We can recommend which type of circuit would be appropriate for your product during the design and development stage. BGA, FINE PITCH, QFN PLACEMENT REPAIR AND REWORK CAPABILITIES Our facility has experience with Ball Grid Array (BGA) surface-mount packaging, Fine Pitch board-to-board connector assembly and Quad Flat No-Lead (QFN) fabrication, repair, and rework.  We offer a variety of automated test and inspection techniques to find manufacturing and functionality defects before they become a bigger problem at the mass production stage, including In-Circuit Test (ICT) systems, Functional Testing and 3D x-ray inspection. BOX BUILD AND SUB-ASSEMBLY CAPABILITIES Box build assembly and sub-assembly is one of our specialties. Our flexibility and adaptability allows to configure to meet any box build needs.  We will ensure your product is built, tested, and packaged to your exact specification for delivery to the end customer. |
PCBA MANUFACTURING CAPACITY
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FACTORY QUALITY CERTIFICATIONS
Quality Certifications include :-
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EQUIPMENT
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