Item	Capability
Layers	1-20
Base materials	XPC FR1 FR2 CEM1 CEM3, FR4, High Tg FR4  IMS
Base copper thickness	1oz. to 4oz.
Board thickness	0.4mm - 3.2mm
Maximum panel size	406mm x 610mm
Minimum hole diameter	0.3mm
PTH hole tolerance	0.05mm
Aspect ratio	6:1
Blind or buried via	Yes
Minimum line width	0.1mm
Minimum line spacing	0.1mm
Minimum bonding pitch	0.127mm
Minimum SMT pitch	0.40mm (centre to centre)
Mechanical fabrication :
Minimum hole registration tolerance (NPTH)	± 0.076mm
Minimum hole registration tolerance (PTH)	± 0.076mm
Minimum pattern registration tolerance	± 0.076mm
Minimum S/M registration tolerance (LPI)	± 0.076mm
Minimum annular ring	± 0.1mm (artwork)
Minimum S/M bridge (LPI)	0.1mm
Plated gold thickness	0.01μm - 0.025μm
Immersion gold thickness	0.025μm - 0.2μm
Twist and warp	Less than 1%
Electrical testing :
Voltage	24V - 300V
Continuity	5Ω - 100Ω

These capabilities and standard specifications are for cost effective board manufacture.
Tighter tolerances and alternative board specifications are available. To discuss, please contact us.