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INSULATED METAL SUBSTRATE (IMS)
In the war on heat, thermal management materials combine with surface mount (SMT) and chip-and-wire (bare dice) technologies.  They are available in single or double layer, aluminium or iron substrate.

As devices shrink but power increases, designers must challenge traditional methods to achieve a reliable product.   With IMS, you can mount an isolated T-220 device with only one fifth the thermal resistance of a conventional assembly.

LAYER MATERIAL THICKNESS PROPERTIES
Circuit
layer
ED copper 1oz 2oz 3oz 4oz
5oz 6oz 10oz
Dielectric
breakdown
6kV
Base
layer
Aluminium
iron and copper
1.0mm 1.6mm
2.0mm 2.36mm
3.2mm
Mechanical:
peel strength
pull strength
Typical values
9 lb/in2
2000lb/in2
Thermal
conductivity
3.2W/m-K   Thermal
conductivity
Typical
3W/m-K
Dielectric
layer
Epoxy-based resin,
typically Kapton
.003 (75μm) Dielectric
breakdown
6kV a.c.
Dielectric
thermal
conductivity:
1.3W/mK
IMS structure
  • Surface mount design reduces PCB area.
  • Simplified construction reduces hardware and assembly costs.
  • IMS replaces fragile ceramic materials.
  • Improved heat transfer:
    • allows more design flexibility.
    • increases reliability and durability.
    • allows combination of power and control circuits.